"Agile Prototyping of AI Hardware LSIs Using Multi-Layer Aluminum Interconnects in a Minimal Fab Environment,"
"the 2025 International Conference on Solid State Devices and Materials (SSDM2025),", Sept.16, 2025.
"Hardware and Software Co-Designed Neuron Array Processor for AI-IoT Applications,"
The Fourth International Workshop on Coarse-Grained Reconfigurable Architectures for High-Performance Computing and AI (CGRA4HPCA),June 3, 2025.
"An SoC Design and Fabrication Hands-on Educational Course within One Week Using Structured ASIC,"
2025 IEEE International Symposium on Circuits and Systems, May 27, 2025.
"誰でも簡単に半導体チップを製造+AIチップを簡単に設計→半導体設計人口を10倍に,"
第29回アナログVLSIシンポジウムパネルディスカッション, 2025 5月16日.
"Can the Agile-chip platform carve out a niche between ASICs and FPGAs?,"
IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 28), April 18, 2025.